Category

Connectors & Inductors

Manufacturer

Omron Electronic Components

Type

DIP, 0.3" (7.62mm) Row Spacing

Number of Positions or Pins (Grid)

8 (2 x 4)

Pitch - Mating

0.100" (2.54mm)

Contact Finish - Mating

Gold

Contact Finish Thickness - Mating

10.0µin (0.25µm)

Contact Material - Mating

Beryllium Copper

Mounting Type

Through Hole

Features

Open Frame

Termination

Solder

Pitch - Post

0.100" (2.54mm)

Contact Finish - Post

Gold

Contact Finish Thickness - Post

10.0µin (0.25µm)

Contact Material - Post

Beryllium Copper

Housing Material

Polybutylene Terephthalate (PBT), Glass Filled

Operating Temperature

-55°C ~ 125°C

Package / Case

-